JPS5874061A - Ｄｉｐ型ケ−スの製造方法 - Google Patents

Ｄｉｐ型ケ−スの製造方法

Info

Publication number
JPS5874061A
JPS5874061A JP17430281A JP17430281A JPS5874061A JP S5874061 A JPS5874061 A JP S5874061A JP 17430281 A JP17430281 A JP 17430281A JP 17430281 A JP17430281 A JP 17430281A JP S5874061 A JPS5874061 A JP S5874061A
Authority
JP
Japan
Prior art keywords
lead
lead frame
dip type
leads
insulating substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17430281A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6255302B2 (en]
Inventor
Shigeru Kubota
茂 久保田
Shoichi Ogura
小倉　昭一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp, Nippon Electric Co Ltd filed Critical NEC Corp
Priority to JP17430281A priority Critical patent/JPS5874061A/ja
Publication of JPS5874061A publication Critical patent/JPS5874061A/ja
Publication of JPS6255302B2 publication Critical patent/JPS6255302B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP17430281A 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法 Granted JPS5874061A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17430281A JPS5874061A (ja) 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17430281A JPS5874061A (ja) 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法

Publications (2)

Publication Number Publication Date
JPS5874061A true JPS5874061A (ja) 1983-05-04
JPS6255302B2 JPS6255302B2 (en]) 1987-11-19

Family

ID=15976282

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17430281A Granted JPS5874061A (ja) 1981-10-29 1981-10-29 Ｄｉｐ型ケ−スの製造方法

Country Status (1)

Country Link
JP (1) JPS5874061A (en])

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6373656A (ja) * 1986-09-17 1988-04-04 Mitsubishi Electric Corp 半導体装置及びその製造方法

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110772A (en]) * 1974-02-08 1975-09-01
JPS5159269A (en) * 1974-11-20 1976-05-24 Nippon Electric Co Handotaisochino seizohoho
JPS5386575A (en) * 1977-01-10 1978-07-31 Mitsubishi Electric Corp Production of semiconductor device
JPS5390867A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Glass hermetic sealing for lead wire

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS50110772A (en]) * 1974-02-08 1975-09-01
JPS5159269A (en) * 1974-11-20 1976-05-24 Nippon Electric Co Handotaisochino seizohoho
JPS5386575A (en) * 1977-01-10 1978-07-31 Mitsubishi Electric Corp Production of semiconductor device
JPS5390867A (en) * 1977-01-21 1978-08-10 Hitachi Ltd Glass hermetic sealing for lead wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6373656A (ja) * 1986-09-17 1988-04-04 Mitsubishi Electric Corp 半導体装置及びその製造方法

Also Published As

Publication number Publication date
JPS6255302B2 (en]) 1987-11-19

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